Turnkey Service Package Product Test Service Co-Design Simulation FA&RA Location:Home-Services-Co-Design Simulation-Mechanical Co-Design Simulation Electrical SI、PI EMITime domainSoftware:HFSS/NPE SIwave/PowerSISnpExpert Mechanical reliabilitystress/strainwarpageSoftware:ANSYS Thermal Thermal resistanceHeat bottleneckisothermSoftware:Flotherm Mold Flow Filling analysisWire SweepFrame DeviationSoftware:Mode3D Packaging reliability analysis Bump stress distribution and risk point prediction in FC packaging Warpage simulation Back Top FA&RA