SiP Packaging (System in Package) integrates multiple functional chips, including processors, memory, and other functional chips into one package to achieve a basic and complete function. Its characteristics: high packaging efficiency、 low system cost small size、 wide application.

Technology Types

● Double Side Molding ● High Density SMD molding

● Selective Molding ● Mold cap 4.0mm power moudule

● lrregular Packaging  ● Ultra-small-size component mount process

● Semiconductor Embedded in substrate

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Technical Advantages 

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Application Area

SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor, wearable devices, smart city and smart automotive.