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Turnkey Service Package Product Test Service Co-Design Simulation FA&RA
Product technology
SiP Fanout Memory MEMS FC
Services
HT-tech:OSAT turnkey service

Location:Home-Services-Package Product

Package Product

Leadframe Package
  • DIP/SIP
    HT-tech(Tianshui)
  • SOT
    HT-tech(Tianshui)
  • SOP/MSOP/VSOP/SSOP/TSSOP
    HT-tech(Tianshui)
  • QFP/LQFP/TQFP
    HT-tech(Tianshui)
  • QFN/DFN
    HT-tech(Xi 'an)
Substrate Package
  • FBGA/TFBGA/LFBGA
    HT-tech(Xi 'an)(Nanjing)
  • LGA
    HT-tech(Xi 'an)(Nanjing)
  • EHS-FBGA
    HT-tech(Xi 'an)(Nanjing)
FlipChip Package
  • FCSOT
    HT-tech(Kunshan)
  • FCDFN/FCQFN
    HT-tech(Kunshan)
  • FCBGA/HFCBGA
    HT-tech(Nanjing)
  • FCCSP/FCLGA
    HT-tech(Nanjing)
  • ED-FCCSP/HB-FCCSP
    HT-tech(Nanjing)
SiP
  • SIP
    HT-tech(Xi 'an)(Kunshan)(Nanjing)
Bumping
  • Copper Pillar Bumping
    HT-tech(Kunshan)
  • Solder Bumping
    HT-tech(Kunshan)(Shanghai)
  • Golden Bumping
    HT-tech(Shanghai)(Nanjing)
WaferLevel
  • TSV
    HT-tech(Kunshan)
  • WLCSP
    HT-tech(Kunshan)
  • Fan-out
    HT-tech(Kunshan)
  • eSinC
    HT-tech(Kunshan)
MEMS & Sensor
  • Metal Lid/LCP Lid
    HT-tech(Nanjing)
  • Customized Mold/Over Mold
    HT-tech(Nanjing)
  • Wafer Level
    HT-tech(Kunshan)

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Test Service