SiP Packaging (System in Package) integrates multiple functional chips, including processors, memory, and other functional chips into one package to achieve a basic and complete function. Its characteristics: high packaging efficiency、 low system cost small size、 wide application.
● Double Side Molding
● High Density SMD molding
● Selective Molding
● Mold cap 4.0mm power moudule
● lrregular Packaging
● Ultra-small-size component mount process
|● Semiconductor Embedded in substrate
SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor, wearable devices, smart city and smart automotive.