HT-tech OSAT Turnkey Service
Turnkey Service
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Package Simulation
Electrical
Thermal
Mechanical
Mold Flow -
Leadframe Package
DIP/SOP、QFP、
QFN、FCQFN
SOT、DFN -
Substrate Package
WB BGA/LGA、FCCSP/FCLGA、
FCBGA、SiP -
Wafer Level Package
Bumping
WLCSP
TSV-CIS
fan-out
RDL -
CP & FT Test
Analog
Dialog
RF
Memory
Program
SLT -
Logistics Service
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Package Design
Leadframe
Substrate
Wafer Level