Location:Home-Technology-Memory
It includes TSSOP, DFN, LGA, BGA packaging, product line covers Nor Flash, SPI NAND, SD NAND, 3D v-nand, eMMC, eMCP, UFS, LPDDR, DDR series, to meet customer high density and high speed requirements.
Product Categories：FLASH | DRAM | Embedded
Application Area
Solid state disk or USB flash disk for mobile phone, car, smart home and other fields.
Representative Products
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3D-VNAND
Specification:
Package Size: 12x18mm 132Ball
Package thickness：1.12mm /1.32mm
Min Die thickness: 30um
8 die –stack/16 die –stack
Substrate thickness:0.13mmApplication:
Solid state disk or USB flash disk -
LPDDR4
Specification:
Package Size: 10x14.5mm 200Ball
Package thickness： 0.92mm
Min Die thickness: 40um
2 die –stack/4 die –stack
Substrate thickness:0.18mm 2L/4LApplication:
Mobile electronics DRAM -
eMMC
Specification:
Package Size: 11.5x13mm 153 Ball
Package thickness： 0.92mm
Min Die thickness: 80um
2 die –stack
Substrate thickness:0.18mm 2LApplication:
Mobile phone, Flat PC, Smart Watch -
eMCP
Specification:
Package Size: 8x10.5mm 162Ball
Package thickness： 0.92mm
Min Die thickness: 80um
3 die –stack
Substrate thickness:0.18mm 2LApplication:
Mobile phone, Flat PC,IoT, Wearable device