Location:Home-Technology-MEMS
MEMS have small size, light weight, low power, high sensitivity, low price, easy mass production and so on, MEMS include a variety of sensors and various package type, very widely use of these sensors, Along with the development of technology, MEMS is become very closed to human life.
MEMES Product Categories:
01 Sound:Silicon microphone
02 Pressure:Altimeter,Barometer,3D touch
03 Inertial:Accelerometer,Gyrometer,6lMU
04 Optical:ALS,Photoelectric sensor,Vcsel,Heart rate sensor,TOF
05 RFMEMS:Filter (SAW&BAW)
06 Magnetic:AMR,TMR
07 Biology:Biology sensor
08 Finger print:Optical,Capacitive
09 Thermal:Temperature and humidity sensor, Temperature sensor
Technical Competence
TSV, RDL, WLCSP, Wafer tevwel bonding, Strip level bonding FC+WB stack die, Coating protection Metal lid attach,
Glass attach Compression molding Customize molding Clear molding, Open molding Can supply ceramic, lead frame,
substrate solutions, various assembly proposal fulfill customer requirements.
Application Area
Smart phone,PAD,wearable,medical,industry, automotive widely
Representative Products
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Cap Mount Product
Specification:
Package Size: 4030,3526,3729,3722,2718
Port Location: Top / Bottom
Cap Type: Metal / Plastic / SubstrateApplication:
Silicon Microphone, Pressure Sensor -
Customized Mold Product
Specification:
Package Type: QFN / LGA
Mold Type: Full Open Mold / Partial Open MoldApplication:
THTB, Optical Sensor, Heart rate sensor etc. -
Over Molding Product
Specification:
Package Type：QFN / LGA
Die Attach Orientation: Horizontal(0° or 180°） / Vertical （90°）Application:
G-sensor, AMR/TMR , Multi-axis Inertial
sensor，RF Filter -
Finger Print Sensor
Specification:
Package Type: QFN / LGA
Mold clearance : Min. 50 um(Over Molding)
Wire loop：Max 30um
Package thickness：Min 0.5mm
Package Outline: Rectangle / CircleApplication:
Mobile Phone, Credit Card , Door Lock,
Suitcase, ID Card etc.