Flip Chip is an ideal interconnect bonding technology. silicon die is directly attached tothe substrate in a face-down way using solder bumps or Cu pillar instead of wire bonds, provides the shortest electrical path  with high electrical andthermal performance. To meet the growing demand for electrical performance, high I/O and high system reliability products.

HT-tech provides a complete solution for flip chip products based on product characteristics.

FC Product Categories

Categories	I/O Specification	Size
FCCSP	36-898	4X4-21X21
FCLGA	5-115	0.7X1.1-31X31
FCBGA/HFCBGA/CFCBGA	256-3981	12*12-65*65
FCDFN/FCQFN/FCSOT	3-56	1×0.6-6X6

Technical Characteristics

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Application Area

AP/CPU/GPU/BB/RFIC chips, Printer, Video monitoring, base station, wireless lan, loT, vehicle electronics, network switch, power management, memory and standard linear, analog etc.