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SiP
SiP Packaging (System in Package) integrates multiple functional chips, including processors, memory, and other functional chips into one package to achieve a basic and complete function. Its characteristics: high packaging efficiency、 low system cost small size、 wide application.
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Fanout
HT-Tech has fully independent intellectual property rights of wafer level fan-out packaging solution --eSiFO , whichcan provide customers with 8 "and 12"wafer level fan-out packaging services.
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Memory
It includes TSSOP, DFN, LGA, BGA packaging, product line covers Nor Flash, SPI NAND, SD NAND, 3D v-nand, eMMC, eMCP, UFS, LPDDR, DDR series, to meet customer high density and high speed requirements.
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MEMS
MEMS have small size, light weight, low power, high sensitivity, low price, easy mass production and so on, MEMS include a variety of sensors and various package type, very widely use of these sensors, Along with the development of technology, MEMS is become very closed to human life.
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FC
Flip Chip is an ideal interconnect bonding technology. silicon die is directly attached to the substrate in a face-down way using solder bumps or Cu pillar instead of wire bonds, provides the shortest electrical path with high electrical andthermal performance. To meet the growing demand for electrical performance, high 1/O and high system reliability products. HT-tech provides a complete solution for ftip chip products based on product characteristics.
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16000+
Employees
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250000+
Clean Room（㎡）
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No. 6
OSAT Worldwide
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No. 2
OSAT in China
News
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2023-12-04
Dare to be the first to seek new development of the sealing and testing industry
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2023-09-02
The 17th Anniversary of the Founding of Huatian Group Commendation Ceremony and Cultural Evening Party was held grandly
In the afternoon of July 28th, the comme...
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2023-06-01
Huatian Technology Collective microgrid held 64 "Collective microgrid Class" activities
On April 27th, Collective microgrid held...