Dare to be the first to seek new development of the sealing and testing industry
On October 26, 2023, the 21st China Semiconductor Assembly & Testing Technology & Market Annual Conference was kicked off at Crown International Convention & Exhibition Hotel in Kunshan, Jiangsu Province. This year's annual meeting to "'Dare' word first, seek new development of the assembly and testing industry" as the theme, more than 2,300 industry professionals from around the world gathered in Kunshan, around the semiconductor assembly and testing of advanced technology, market, application of hot topics for discussion. This annual meeting is guided by China Semiconductor Industry Association, hosted by China Semiconductor Industry Association Assembly Branch, and organized by Tianshui Huatian Technology Co., Ltd, Kunshan Economic and Technological Development Zone Management Committee, Kunshan City Bureau of Industry and Information Technology, and Beijing Fields Information Consulting Co.
Wei Zhou, member of Suzhou Municipal Committee and secretary of Kunshan Municipal Committee, Min Luo, deputy director of Suzhou Municipal Bureau of Industry and Information Technology, Minzhong Xu, member of Kunshan Municipal Committee, deputy secretary of the CPC Working Committee and deputy director of the Management
Committee of Kunshan Development Zone, Xudong Qian , vice mayor of Kunshan Municipal People's Government, Xiaodong Zhang, member of the CPC Working Committee and deputy director of the Management Committee of Kunshan Development Zone, as well as the leaders of the Suzhou Municipal Bureau of Industry and Information Technology and relevant departments of the Kunshan Municipal Government, were present at the event. In addition, Dr. Zixiao Guan of the Integrated Circuit Division of the Department of Electronic Information of the Ministry of Industry and Information Technology, Tianchun Ye, Academician of the International Eurasian Academy of Sciences, Vice President of the China Semiconductor Industry Association and Chairman of the Integrated Circuit Branch, Yuanchao Liu, Vice President of the China Semiconductor Industry Association, Shengli Xiao, Chairman of the Assembly & Testing Branch of the China Semiconductor Industry Association and Chairman of the Board of Huatian Group, Zhiyi Xiao, Vice President of the China Semiconductor Industry Association, Chairman of the Assembly & Testing Branch of the Board of Directors, and Vice President of the Huatian Group, General Manager of Huatian Science & Technology (Kunshan) Electronics Company Limited, as well as a number of industry experts and representatives attended this event.
As one of the most important communication platforms in China's semiconductor assembly and testing industry, the annual meeting was attended by nearly 3,000 delegates and more than 100 exhibitors, bringing together many related enterprises from upstream and downstream of the industry chain. At the same time, the main forum also opened a live online broadcast, invited industry colleagues to watch together. At the meeting, we took "'Dare' as the first word, seek new development of the assembly and testing industry" as the theme, and explored the industry hot issues such as semiconductor advanced assembly and testing technology, featured assembly and testing process technology, assembly and testing equipment, key materials, innovation and investment and other industry hot issues together. Collaborative development and innovation road.
At 9:00 a.m. on October 26, the General Assembly opened with the solemn sound of the national anthem.
Shengli Xiao Honorary Chairman of China Semiconductor Industry Association, Yuanchao Liu, Vice Chairman of China Semiconductor Industry Association, Wei Zhou, Member of the Standing Committee of Suzhou Municipal Committee and Secretary of Kunshan Municipal Committee, Jiangsu Province, Tianchun Ye, Secretary General of China IC Innovation Alliance and Academician of International Eurasian Academy of Sciences, and Shaojun Wei, Professor of Tsinghua University, Academician of International Eurasian Academy of Sciences and Vice Chairman of China Semiconductor Industry Association, delivered speeches. Dongmei Xu, Deputy Secretary General of China Semiconductor Industry Association and Secretary General of Assembly and Testing Branch, presided over the meeting.
Mr. Xiao pointed out that in recent years, China's semiconductor industry has made remarkable achievements under the support of national policies. Combined with the theme of this annual meeting, Mr. Xiao hopes that we will dare to innovate and lead the change in the face of industry challenges and difficulties. At the same time, he also wished all the leaders, experts and guests to have a full harvest during the conference, and jointly contribute wisdom and strength to promote the development of semiconductor assembly and testing technology in China!
Frontier Thinking Focus on Innovation Leadership
Keynote speeches, experts and scholars from the field of semiconductor assembly and testing at home and abroad, industry elites in turn for the keynote report, to discuss the new situation of the IC industry under the development of new opportunities and new challenges.
Vice President of China Semiconductor Industry Association (CSIA), Chairman of Assembly & Testing Branch, Vice President of Huatian Group and General Manager of Huatian Technology (Kunshan) Electronics Company Limited, Zhiyi Xiao, on behalf of Assembly & Testing Branch, made a report on the industry - "China's semiconductor assembly and testing industry status quo and outlook". Mr. Xiao mainly focuses on the development of the world's assembly and testing industry, the current situation of the domestic assembly and testing industry, the opportunities and challenges of China's assembly and testing industry, and the development of China's assembly and testing industry to think about the four aspects of the development of a detailed exposition. Mr. Xiao said that although we are facing challenges such as insufficient competitiveness of advanced assembly and weak growth of China's IC testing industry, under the strong support of government policies, China's IC terminal market is stable and improving as a whole. At the same time, the short board of domestic semiconductor industry chain will usher in a wave of new window period, especially in the field of semiconductor equipment manufacturing, advanced assembly, high-end assembly materials, Mr. Xiao pointed out that the development of the IC industry must play a new type of national system advantages, the formation of a strong synergy to promote scientific and technological innovation, so as to inject surging kinetic energy for the industrial upgrading!
Huatian Technology (Kunshan) Electronics Co., Ltd. R & D Director & Research Institute President Shuying Ma in the "advanced assembly to help China's" core "breakthrough" report, closely linked to the pulse of the industry, the company's development, cutting-edge hotspots, etc., from the introduction of the development of advanced assembly, Huatian Technology, the layout of the advanced assembly, the development of advanced assembly of great significance of the three aspects of the details In the report, the company has made a deep thought.
Xiaowei Guo, Technical Director of Huatian Technology (Xi'an) Co., Ltd, in the report " Assembly and Testing Control of Vehicle-mounted Products", detailed the standard requirements for personnel, equipment, materials, methods, cleanliness, and measurement of vehicle-mounted products in the process of assembly and testing from the perspectives of people, machines, materials, methods, environment, and measurement. Shared the special process concerns in the assembly and testing process of in-vehicle products as well as the viewpoints on the automatic control of the system.
In the course of the report, the semiconductor industry, the authority of the elite to grasp the industry hotspots, in order to enhance and optimize the industry as the basic goal, for the participants to bring covering industry trends, technological change and other multi-dimensional information!
Exhibitors gather to open a new situation
On-site exhibition, a total of more than 100 exhibitors, from the vertical extension of the upstream and downstream industry chain to the cross-border linkage of industry applications, everywhere reflecting the semiconductor industry's continuous upgrading vitality. During the exhibition and exchange, all the participants had in-depth exchanges, fully collision of wisdom, practical cooperation, and help China's semiconductor industry synergistic high-speed development.
In addition to the main forum, there are five sub-forums, technical seminars, new product launches and other series of activities such as " Assembly Testing and Process Equipment Innovation and Opportunities", " Assembly Key Materials Innovation and Cooperation", "Automotive Electronics Chip and Power Compound Semiconductor Assembly and Testing Technology", "Advanced Assembly and Testing Technology", and "Henkel Session", which are aimed at gathering the consensus of the "core", sharing the opportunities of the "core", and fulfilling the dream of the "core".
From 0 to 21, China Semiconductor Assembly and Testing Technology and Market Conference has ushered in the "21st birthday", and it seems that the overall situation, whether it is the number of exhibitors, the scale of the exhibition, or the influence of the exhibition, are increasing year by year. This year's conference continues the open mode of "exhibition + meeting", presenting the development status of the industry chain in an all-round way, strengthening the cooperation and exchange in the field of integrated circuits, thus promoting China's integrated circuit industry to achieve higher quality development.
The participation of Huatian Technology injected new vitality and impetus into this annual meeting and demonstrated the company's leading position in the domestic semiconductor assembly and testing field. Through the interaction and communication with industry colleagues, Huatian Technology will further grasp the market opportunities, expand business fields, enhance core competitiveness, and make greater contributions to the development of China's semiconductor industry.