Turnkey Service Package Product Test Service Co-Design Simulation FA&RA Location:Home-Services-Package Product Package Product Leadframe Package Substrate Package FlipChip Package SiP Bumping WaferLevel MEMS & Sensor Leadframe Package DIP/SIPHT-tech(Tianshui) SOTHT-tech(Tianshui) SOP/MSOP/VSOP/SSOP/TSSOPHT-tech(Tianshui) QFP/LQFP/TQFPHT-tech(Tianshui) QFN/DFNHT-tech(Xi 'an) Substrate Package FBGA/TFBGA/LFBGAHT-tech(Xi 'an)(Nanjing) LGAHT-tech(Xi 'an)(Nanjing) EHS-FBGAHT-tech(Xi 'an)(Nanjing) FlipChip Package FCSOTHT-tech(Kunshan) FCDFN/FCQFNHT-tech(Kunshan) FCBGA/HFCBGAHT-tech(Nanjing) FCCSP/FCLGAHT-tech(Nanjing) ED-FCCSP/HB-FCCSPHT-tech(Nanjing) SiP SIPHT-tech(Xi 'an)(Kunshan)(Nanjing) Bumping Copper Pillar BumpingHT-tech(Kunshan) Solder BumpingHT-tech(Kunshan)(Shanghai) Golden BumpingHT-tech(Shanghai)(Nanjing) WaferLevel TSVHT-tech(Kunshan) WLCSPHT-tech(Kunshan) Fan-outHT-tech(Kunshan) eSinCHT-tech(Kunshan) MEMS & Sensor Metal Lid/LCP LidHT-tech(Nanjing) Customized Mold/Over MoldHT-tech(Nanjing) Wafer LevelHT-tech(Kunshan) Back Top Test Service